The number of GPU startups in China is extraordinary as the country tries to gain AI prowess as well as semiconductor sovereignty, according to a new report from Jon Peddie Research. From a report: In addition, the number of GPU makers grew worldwide in recent years as demand for artificial intelligence (AI), high-performance computing (HPC), and graphics processing increased at a rather unprecedented rate. When it comes to discrete graphics for PCs, AMD and Nvidia maintain lead, whereas Intel is trying to catch up.

Tens of companies developed graphics cards and discrete graphics processors in the 1980s and the 1990s, but cut-throat competition for the highest performance in 3D games drove the vast majority of them out of business. By 2010, only AMD and Nvidia could offer competitive standalone GPUs for gaming and compute, whereas others focused either on integrated GPUs or GPU IP. The mid-2010s found the number of China-based PC GPU developers increasing rapidly, fueled by the country's push for tech self-sufficiency as well as the advent of AI and HPC as high-tech megatrends.

In total, there are 18 companies developing and producing GPUs, according to Jon Peddie Research. There are two companies that develop SoC-bound GPUs primarily with smartphones and notebooks in mind, there are six GPU IP providers, and there are 11 GPU developers focused on GPUs for PCs and datacenters, including AMD, Intel, and Nvidia, which design graphics cards that end up in our list of the best graphics cards. In fact, if we added other China-based companies like Biren Technology and Tianshu Zhixin to the list, there would be even more GPU designers. However, Biren and Tianshu Zhixin are solely focused on AI and HPC for now, so JPR does not consider them GPU developers.

An anonymous reader shares a report: I reviewed a number of laptops in 2022 across consumer, workstation, gaming, business, Chromebook, and everywhere else. I touched all of the major brands. But I had a particular focus on ultraportables this year -- that is, thin and light devices that people buy to use, say, on their couch at home -- because, with Apple's MacBooks in such a dominant position, many eyes have been on their competitors on the Windows side. For many of these models, I found myself writing the same review over and over and over. They were generally good. They performed well. But their battery life was bad.

What these laptops had in common is that they were all powered by the Intel P-series. Without getting too into the weeds here, Intel processors have, in the past, included H-series processors -- powerful chips that you'll find in gaming laptops and workstations -- and U-series processors for thinner, lighter devices. (There was also a G-series, which was this whole other thing, for a couple of years.) But the Intel 12th Generation of mobile chips (that is, the batch of chips that Intel released this year) has a new letter: the P-series. The P-series is supposed to sit between the power-hungry H-series and the power-efficient U-series; the hope was that it would combine H-series power with U-series efficiency.

And then many -- a great many -- of this year's top ultraportable laptops got the P-series: big-screeners like the LG Gram 17; modular devices like the Framework Laptop; business notebooks like the ThinkPad X1 Yoga Gen 7; premium ultraportables like the Acer Swift 5, the Lenovo Yoga 9i, the Samsung Galaxy Book2 Pro, and the Dell XPS 13 Plus. The problem was that, in reality, the P-series was just a slightly less powerful H-series chip, which Intel had slapped an "ultraportable" label onto. It was identical to the H-series in core count and architecture, but it was supposed to draw slightly less power.

Intel announced today that it would split its AXG graphics group to separately address the gaming and data center markets by placing it under two other business units. Raja Koduri, currently the Executive Vice President of the AXG business unit, will return to his previous role as an Intel Chief Architect. From a report: "Discrete graphics and accelerated computing are critical growth engines for Intel. With our flagship products now in production, we are evolving our structure to accelerate and scale their impact and drive go-to-market strategies with a unified voice to customers. This includes our consumer graphics teams joining our client computing group, and our accelerated computing teams joining our datacenter and AI group. In addition, Raja Koduri will return to the Intel Chief Architect role to focus on our growing efforts across CPU, GPU and AI, and accelerating high priority technical programs," Intel said.

We spoke with Intel, and the company assures us that it remains fully committed to its existing roadmap of Arc consumer discrete GPUs, meaning it intends to launch the second-gen Battlemage and third-gen Celestial gaming GPUs as planned. Those GPUs will join the recently launched Alchemist series, which will also continue to be supported.

An anonymous reader quotes a report from Bloomberg, written by Mark Gurman: The new high-end Mac Pro with Apple silicon is behind schedule, and you can blame changes to the company's chip and manufacturing plans. When Apple announced plans in June 2020 to transition away from Intel processors to Mac chips designed in-house, the company said the move would take about two years. Now at the tail end of 2022, it's clear that Apple has missed its self-imposed deadline for completing the shift. In addition to not offering a Mac Pro with Apple silicon, the company still only sells the high-end version of the Mac mini desktop in an Intel flavor. While Apple has said little to nothing about its future Mac desktops or the reasons behind the holdup, the company continues to actively test an all-new Mac Pro and an M2 Pro-based Mac mini to replace the remaining Intel models. Apple had aimed to introduce the new Mac Pro by now, but the high-end machine has been held up for a number of reasons, including multiple changes to its features, a significant shift in the company's plans for high-end processors and a potential relocation of its manufacturing.

When Apple first set out to build a replacement for the Intel Mac Pro, it planned a machine with a processor based on the original M1 chip. The approach called for two main configurations: one chip equal to the power of two M1 Max processors -- the highest-end MacBook Pro chip -- and another equal to four M1 Max components combined. The dual M1 Max chip ended up first launching in the Mac Studio as the M1 Ultra, and Apple decided to push back the Mac Pro to the M2 generation. The company then planned for the Mac Pro to come in two configurations: an M2 Ultra version and a double-M2 Ultra that I've dubbed the "M2 Extreme." The M2 Ultra chip is destined to have some serious specifications for professional users, including up to 24 CPU cores, 76 graphics cores and the ability to top out the machine with at least 192 gigabytes of memory. An M2 Extreme chip would have doubled that to 48 CPU cores and 152 graphics cores. But here's the bad news: The company has likely scrapped that higher-end configuration, which may disappoint Apple's most demanding users -- the photographers, editors and programmers who prize that kind of computing power.

The company made the decision because of both the complexity and cost of producing a processor that is essentially four M2 Max chips fused together. It also will help Apple and partner Taiwan Semiconductor Manufacturing Co. save chip-production resources for higher-volume machines. Moreover, there are concerns about how much consumers are willing to spend. Using the highest-end M1 Ultra chip pushes the Mac Studio up to $5,000 -- only $1,000 less than the current Mac Pro. That's $3,000 more than the M1 Max Mac Studio. Based on Apple's current pricing structure, an M2 Extreme version of a Mac Pro would probably cost at least $10,000 -- without any other upgrades -- making it an extraordinarily niche product that likely isn't worth the development costs, engineering resources and production bandwidth it would require. Instead, the Mac Pro is expected to rely on a new-generation M2 Ultra chip (rather than the M1 Ultra) and will retain one of its hallmark features: easy expandability for additional memory, storage and other components. Gurman says the Mac Mini update "will come in regular M2 and M2 Pro variations, while new 14-inch and 16-inch MacBook Pros are arriving early next year with M2 Pro and M2 Max options." A high-end iMac Pro with Apple silicon is also in the works, "but that machine has suffered internal delays for similar reasons as the Mac Pro," he notes.

In addition, Gurman says Apple is "working on multiple new external monitors [...], including an update to the Pro Display XDR that was launching alongside the Intel Mac Pro in 2019." The new monitors will also include Apple silicon.

An anonymous reader quotes a report from Ars Technica: Dell continues tinkering with what it hopes to be a repairable laptop like the Framework Laptop. Last year, it showed off Concept Luna, a clamshell designed to easily disassemble for easy repairs, upgrades, and harvested components. This year, Dell showed the press an updated Concept Luna that could support more power while being even simpler to dismantle. The vendor is also exploring how to automate the process, from disassembly to parts diagnostics, on a broad scale. Dell's Concept Luna laptop is comparable in size to a Latitude with some Dell XPS 13 Plus-like stylings. In person, it looked similar to the Concept Luna demoed last year, including appearing to be a functioning PC. But Dell's representative was able to open this year's version up and pull out internal parts much more rapidly -- well under 60 seconds.

The computer was easier to take apart because it doesn't have screws (last year's Concept Luna had four). Dell's rep simply stuck a pin (it could be anything that fits, they said) into a hole in the security lock slot on the right side of the system's deck. That allowed Dell's rep to pull off the keystone north of the keyboard and then slide the keyboard up and out. Once the system was open, the speakers, fan, motherboard, and battery were removed instantly thanks to pop-out modules, which, Dell said, are recyclable. The concept laptop also got rid of the cable connecting the battery, so there are no cables, adhesives, or other types of connectors.

Dell built Concept Luna with simple display upgrades and repairs in mind as well. Dell's spokesperson promptly removed the system's LCD by inserting a pin into a hole in a keystone south of the screen and then took off the keystone, releasing a latch underneath the piece, and plucked the display off the chassis. There's also potential for better accommodations for beefier components in the updated Concept Luna. Last year's version used passive cooling, while the new one has a fan. The fans lock into the motherboard, keeping it in place. A tech giant like Dell releasing something like Concept Luna could certainly give the younger Framework a run for its money, but Dell still isn't talking about releasing a laptop with Concept Luna's repairability. And it could ultimately decide not to. However, in addition to advancing the laptop's design this year, Dell also looked into automation techniques that could further this concept on a scale that could extend beyond a single product.

Anyone remember the high-end commercial UNIX workstations from a few decades ago — like from companies like IBM, DEC, SGI, and Sun Microsystems?

Today OSnews looked back — but also explored what happens when you try to buy one today> : As x86 became ever more powerful and versatile, and with the rise of Linux as a capable UNIX replacement and the adoption of the NT-based versions of Windows, the days of the UNIX workstations were numbered. A few years into the new millennium, virtually all traditional UNIX vendors had ended production of their workstations and in some cases even their associated architectures, with a lacklustre collective effort to move over to Intel's Itanium — which didn't exactly go anywhere and is now nothing more than a sour footnote in computing history.

Approaching roughly 2010, all the UNIX workstations had disappeared.... and by now, they're all pretty much dead (save for Solaris). Users and industries moved on to x86 on the hardware side, and Linux, Windows, and in some cases, Mac OS X on the software side.... Over the past few years, I have come to learn that If you want to get into buying, using, and learning from UNIX workstations today, you'll run into various problems which can roughly be filed into three main categories: hardware availability, operating system availability, and third party software availability.
Their article details their own attempts to buy one over the years, ultimately concluding the experience "left me bitter and frustrated that so much knowledge — in the form of documentation, software, tutorials, drivers, and so on — is disappearing before our very eyes." Shortsightedness and disinterest in their own heritage by corporations, big and small, is destroying entire swaths of software, and as more years pass by, it will get ever harder to get any of these things back up and running.... As for all the third-party software — well, I'm afraid it's too late for that already. Chasing down the rightsholders is already an incredibly difficult task, and even if you do find them, they are probably not interested in helping you, and even if by some miracle they are, they most likely no longer even have the ability to generate the required licenses or release versions with the licensing ripped out. Stuff like Pro/ENGINEER and SoftWindows for UNIX are most likely gone forever....

Software is dying off at an alarming rate, and I fear there's no turning the tide of this mass extinction.
The article also wonders why companies like HPE don't just "dump some ISO files" onto an FTP server, along with patch depots and documentation. "This stuff has no commercial value, they're not losing any sales, and it will barely affect their bottom line.

The next wave of Moore's Law will rely on a developing concept called system technology co-optimization, Ann B. Kelleher, general manager of technology development at Intel told IEEE Spectrum in an interview ahead of her plenary talk at the 2022 IEEE Electron Device Meeting. From a report: "Moore's Law is about increasing the integration of functions," says Kelleher. "As we look forward into the next 10 to 20 years, there's a pipeline full of innovation" that will continue the cadence of improved products every two years. That path includes the usual continued improvements in semiconductor processes and design, but system technology co-optimization (STCO) will make the biggest difference. Kelleher calls it an "outside-in" manner of development. It starts with the workload a product needs to support and its software, then works down to system architecture, then what type of silicon must be within a package, and finally down to the semiconductor manufacturing process. "With system technology co-optimization, it means all the pieces are optimized together so that you're getting your best answer for the end product," she says.

STCO is an option now in large part because advanced packaging, such as 3D integration, is allowing the high-bandwidth connection of chiplets -- small, functional chips -- inside a single package. This means that what would once be functions on a single chip can be disaggregated onto dedicated chiplets, which can each then be made using the most optimal semiconductor process technology. For example, Kelleher points out in her plenary that high-performance computing demands a large amount of cache memory per processor core, but chipmaker's ability to shrink SRAM is not proceeding at the same pace as the scaling down of logic. So it makes sense to build SRAM caches and compute cores as separate chiplets using different process technology and then stitch them together using 3D integration. A key example of STCO in action, says Kelleher, is the Ponte Vecchio processor at the heart of the Aurora supercomputer. It's composed of 47 active chiplets (as well as 8 blanks for thermal conduction). These are stitched together using both advanced horizontal connections (2.5 packaging tech) and 3D stacking. "It brings together silicon from different fabs and enables them to come together so that the system is able to perform against the workload that it's designed for," she says.

Chipmaker AMD has hinted that new transistor technology will keep Moore's Law alive for the next six to eight years, but as one might guess, it will cost more. From a report: Meanwhile, the company still plans to market new chips based on its Zen 4 architecture next year, including Bergamo, which is intended to compete against Arm-based chips for cloud-native computing. In an interview with Wells Fargo analyst Aaron Rakers at the financial outfit's TMT Summit, AMD CTO Mark Papermaster talked about future directions and the company's near-term roadmap. Rakers asked about the Zen family and its chiplet-based architecture versus the monolithic architecture seen with Intel's CPUs, and whether this would continue to serve AMD for the next four to five years, or whether another novel approach might be needed.

"Innovation always finds its way around barriers," Papermaster said. "I can see exciting new transistor technology for the next -- as far as you can really plot these things out -- about six to eight years, and it's very, very clear to me the advances that we're going to make to keep improving the transistor technology, but they're more expensive," he said. In the past, chipmakers like AMD and Intel could double the transistor density every 18 to 24 months and stay within the same cost envelope, but that is not the case anymore, Papermaster claimed. "So, we're going to have innovations in transistor technology. We're going to have more density. We're going to have lower power, but it's going to cost more. So how you put solutions together has to change," he said.

guest reader writes: Chipmaker Intel is offering staff in Ireland the opportunity to take three months' leave from their jobs, with the catch being that it is unpaid. The move is part of cost saving measures at the company. According to various reports in the Irish media, thousands of workers at Intel's manufacturing plant in Leixlip, County Kildare, were offered three months' voluntary unpaid leave in a bid to lower overheads.

The move follows Intel's announcement in October that it planned to lay off an unspecified number of employees worldwide, and even ditch some product lines, in response to a worsening economic situation. These plans are part of a massive reduction in spending, with Intel looking slash $3 billion annually starting next year and by between $8 billion and $10 billion by 2025. However, this isn't going to stop the chipmaker from continuing to invest in building new chip manufacturing plants, as Intel confirmed this week when the company reiterated its commitment to manufacturing expansions in the US and in Europe that are set to cost billions of dollars. In an official statement sent to The Register, Intel said it was taking steps to reduce costs and improve efficiencies detailed during its recent earnings call, while protecting the investments needed to position the company for long-term growth.

An anonymous reader shares a report: Nvidia's new RTX 4090 and 4080 GPUs both use a new connector called 12VHPWR to deliver power as a way to satisfy ever-more power-hungry graphics cards without needing to set aside the physical space required for three or four 8-pin power connectors. But that power connector and its specifications weren't created by Nvidia alone -- to ensure interoperability, the spec was developed jointly by the PCI Express Special Interest Group (PCI-SIG), a body that includes Nvidia, AMD, Intel, Arm, IBM, Qualcomm, and others.

But the overheating and melting issues experienced by some RTX 4090 owners recently have apparently prompted the PCI-SIG to clarify exactly which parts of the spec it is and is not responsible for. In a statement reported by Tom's Hardware, the group sent its members a reminder that they, not the PCI-SIG, were responsible for safety testing products using connector specs like 12VHPWR. "Members are reminded that PCI-SIG specifications provide necessary technical information for interoperability and do not attempt to address proper design, manufacturing methods, materials, safety testing, safety tolerances, or workmanship," the statement reads. "When implementing a PCI-SIG specification, Members are responsible for the design, manufacturing, and testing, including safety testing, of their products."

Amazon's cloud-computing unit is rolling out new chips designed to power the highest-end of computing, supporting tasks such as weather forecasting and gene sequencing. From a report: Amazon Web Services, the largest provider of over-the-internet computing, on Monday said it would let customers rent computing power that relies on a new version of its Graviton chips. Peter DeSantis, a senior vice president who oversees most of AWS's engineering teams, said in an interview that the product is a springboard for making what the industry calls high-performance computing more readily available.

The newest chip is the latest piece of Amazon's effort to build more of the hardware that fills the massive data centers that power AWS. Amazon says making its own chips will give customers more cost-effective computing power than they could get by renting time on processors built by the likes of Intel Corp., Nvidia Corp. or Advanced Micro Devices. The move has put AWS in direct competition with those companies, which are also among its biggest suppliers. DeSantis said the chipmakers remain "great partners," and that AWS plans to continue to offer high-performance computing services based on chips made by other companies.

On Tuesday, AWS Chief Executive Officer Adam Selipsky announced a new version of the Inferentia chip, which is designed to draw inferences from vast amounts of data. Inferentia2 is built to handle bigger sets of data than its predecessor, enabling things like software-generated images or detecting and interpreting human speech, Amazon said. [...] The latest version of AWS's line of Graviton processors, the Graviton3E, will have twice the ability of current versions in one type of calculations needed by high-performance computers, DeSantis said. When combined with other AWS technology, the new offering will be 20% better than the previous one. Amazon didn't say when services based on the new chip would be available.

Intel has officially revealed its Intel On Demand program that will activate select accelerators and features of the company's upcoming Xeon Scalable Sapphire Rapids processor. The new pay-as-you-go program will allow Intel to reduce the number of SKUs it ships while still capitalizing on the technologies it has to offer. From a report: Furthermore, its clients will be able to upgrade their machines without replacing actual hardware or offering additional services to their clients. Intel's upcoming Intel's 4th Generation Xeon Scalable Sapphire Rapids processors are equipped with various special-purpose accelerators and security technologies that all customers do not need at all times. To offer such end-users additional flexibility regarding investments, Intel will deliver them to buy its CPUs with those capabilities disabled but turn them on if they are needed at some point. The Software Defined Silicon (SDSi) technology will also allow Intel to sell fewer CPU models and then enable its clients or partners to activate certain features if needed (to use them on-prem or offer them as a service). The list of technologies that Intel wants to make available on demand includes Software Guard Extensions, Dynamic Load Balancer (DLB), Intel Data Streaming Accelerator (DSA), Intel In-Memory Analytics Accelerator (IAA), Intel In-Memory Analytics Accelerator, and Intel QuickAssist Technology (QAT) to accelerate specific workloads.

The head of Intel's revitalized contract chip manufacturing business plans to step down, The Register has learned, creating a setback for the x86 behemoth's big bet to take on Asian foundry giants TSMC and Samsung as part of its comeback plan. From the report: Randhir Thakur, senior vice president and president of Intel Foundry Services, "has decided to pursue other opportunities" but will continue to lead the business unit through the first quarter of 2023 to "ensure a smooth transition to a new leader," Intel CEO Pat Gelsinger said in an email to employees Monday that was seen by el Reg. Intel spokesperson William Moss confirmed the news with us. "We're grateful to Randhir for the tremendous progress IFS has made and for laying the foundation for Intel to become a world-class systems foundry," Moss said in a statement. "We wish him all the best in his new endeavors."

In his email, Gelsinger said he will share more information soon "about the new leader" for Intel Foundry Services, suggesting the company may have a successor in place -- or is at least close to having one. "Randhir has been a key member of the Executive Leadership Team for the past two and a half years and has served in several senior leadership roles since he joined us in 2017," Gelsinger wrote. "... His contributions to our [Integrated Device Manufacturing] 2.0 transformation are many, but most notable is his leadership in standing up our IFS business."

Intel revitalized its contract chip manufacturing business in early 2021 and renamed it Intel Foundry Services with the goal of competing with TSMC and Samsung, the world's two largest contract chip manufacturers that make chips for the likes of Intel rivals, including AMD, Nvidia, and Apple. In his email to employees, Gelsinger credited Thakur for establishing a "seasoned leadership team with veterans from leading foundries" like TSMC and Samsung. He added that the Intel Foundry Services leader also "secured major customer wins in the mobile and auto segments" and helped the company win the US government's RAMP-C award along with four customers for chip designs on its 18A node. "Since Q2, IFS has expanded engagements to seven of the 10 largest foundry customers coupled with consistent pipeline growth to include 35 customer test chips," Gelsinger said. "This is tremendous progress in only 20 months!" Intel has a pending $5.4 billion acquisition of Israeli chip manufacturer Tower Semiconductor, notes The Register. "Analysts responding to the news of Thakur's resignation said the move is likely happening because Intel plans to put Tower Semiconductor's management in charge of Intel Foundry Services." The deal is expected to close in the first quarter of 2023.

VMware today announced the launch of Fusion 13, the latest major update to the Fusion virtualization software. MacRumors reports: For those unfamiliar with Fusion, it is designed to allow Mac users to operate virtual machines to run non-macOS operating systems like Windows 11. Fusion 13 Pro and Fusion 13 Player are compatible with both Intel Macs and Apple silicon Macs equipped with M-series chips, offering native support. VMware has been testing Apple silicon support for several months now ahead of the launch of the latest version of Fusion.

With Fusion 13, Intel and Apple silicon Mac users can access Windows 11 virtual machines. Intel Macs offer full support for Windows 11, while on Apple silicon, VMware says there is a first round of features for Windows 11 on Arm. Users who need to run traditional win32 and x64 apps can do so through built-in emulation. Fusion 13 also includes a TPM 2.0 virtual device that can be added to any VM, storing contents in an encrypted section of the virtual machine files and offering hardware-tpm functionality parity. To support this feature, Fusion 13 uses a fast encryption type that encrypts only the parts of the VM necessary to support the TPM device for performance and security. The software supports OpenGL 4.3 in Windows and Linux VMs on Intel and in Linux VMs on Apple silicon.

An anonymous reader quotes a report from VentureBeat: On Monday, Intel introduced FakeCatcher, which it says is the first real-time detector of deepfakes -- that is, synthetic media in which a person in an existing image or video is replaced with someone else's likeness. Intel claims the product has a 96% accuracy rate and works by analyzing the subtle "blood flow" in video pixels to return results in milliseconds. Ilke Demir, senior staff research scientist in Intel Labs, designed FakeCatcher in collaboration with Umur Ciftci from the State University of New York at Binghamton. The product uses Intel hardware and software, runs on a server and interfaces through a web-based platform.

Unlike most deep learning-based deepfake detectors, which look at raw data to pinpoint inauthenticity, FakeCatcher is focused on clues within actual videos. It is based on photoplethysmography, or PPG, a method for measuring the amount of light that is absorbed or reflected by blood vessels in living tissue. When the heart pumps blood, it goes to the veins, which change color. With FakeCatcher, PPG signals are collected from 32 locations on the face, she explained, and then PPG maps are created from the temporal and spectral components. "We take those maps and train a convolutional neural network on top of the PPG maps to classify them as fake and real," Demir said. "Then, thanks to Intel technologies like [the] Deep Learning Boost framework for inference and Advanced Vector Extensions 512, we can run it in real time and up to 72 concurrent detection streams."

"FakeCatcher is a part of a bigger research team at Intel called Trusted Media, which is working on manipulated content detection -- deepfakes -- responsible generation and media provenance," she said. "In the shorter term, detection is actually the solution to deepfakes -- and we are developing many different detectors based on different authenticity clues, like gaze detection." The next step after that will be source detection, or finding the GAN model that is behind each deepfake, she said: "The golden point of what we envision is having an ensemble of all of these AI models, so we can provide an algorithmic consensus about what is fake and what is real." Rowan Curran, AI/ML analyst at Forrester Research, told VentureBeat by email that "we are in for a long evolutionary arms race" around the ability to determine whether a piece of text, audio or video is human-generated or not.

"While we're still in the very early stages of this, Intel's deepfake detector could be a significant step forward if it is as accurate as claimed, and specifically if that accuracy does not depend on the human in the video having any specific characteristics (e.g. skin tone, lighting conditions, amount of skin that can be see in the video)," he said.

An anonymous reader quotes a report from The Guardian: The powerful lithium ion batteries used in small electric vehicles are responsible for a growing epidemic of fires. This year, there have been about 200 fires and six deaths, according to the New York City fire department. This month, an e-bike fire inside a Manhattan high-rise apartment became an inferno that injured nearly 40 people and forced firefighters to evacuate residents using ropes. These fires can spread quickly and suddenly: "We have a fully formed fire within a matter of seconds," the chief fire marshal said at a news conference.

As the densest city in America, New York is a micro-mobility haven. Here, small electric vehicles aren't toys for weekend jaunts but vital tools for the estimated 65,000 delivery workers trying to scrape a living through low-paying apps. There are thousands of choices today if you want an e-bike, e-scooter or e-moped. Some of the high-end, name-brand machines are sold in beautiful downtown showrooms for well over $5,000. But many of the vehicles used by New York City's workers come from unknown manufacturers and are sold online or through small shops for between $1,000 and $2,000. Nearly all of these vehicles are powered by lithium ion battery packs, which contain tightly bundled cells that store energy as flammable chemicals. Typically, the cells are kept in sync by a piece of electronic circuitry called a battery management system, or BMS, which makes sure that the cells don't overcharge or release too much energy at once. But that careful balance can get disrupted due to damage, wear or faulty manufacturing, sometimes with dangerous results.

Lawmakers are worried too. The authority that manages New York's public housing proposed an e-bike ban on its property this year but backed down after an outcry from low-income residents. On Monday, the city council held a hearing where legislators touted bills to combat the battery fires, including a proposal to outlaw the sale of secondhand electric vehicle batteries, and another to ban all batteries that haven't been approved by a nationally recognized testing lab. If passed, that measure would force riders to use batteries such as those certified by the Illinois-based Underwriters Laboratory (UL), which subjects e-bikes and their batteries to rigorous testing on issues ranging from their performance under extreme temperatures to how easily fire spreads between cells. Manufacturers have to pay a "nominal" cost to undergo testing, said Robert Slone, UL's chief scientist, but "we see a lot of manufacturers showing interest in certifying the batteries". UL sent a statement to the city council supporting the proposed measures, though it said a total ban on used batteries could be overkill: "When done correctly, batteries can be safely repurposed." Something else that would make a big difference for workers is better intel. "Each fire happened, they say it's an e-bike, but we don't know which one it is," said Gustavo Ajche, the founder of Los Deliveristas Unidos, a prominent delivery worker labor group. "There's a lot of missing information."

What would be more useful, he said, would be if the fire department committed resources to testing and sharing details about which batteries were safe to use, so that workers could make more informed decisions.

Intel's latest plan to ward off rivals from high-performance computing workloads involves a CPU with large stacks of high-bandwidth memory and new kinds of accelerators, plus its long-awaited datacenter GPU that will go head-to-head against Nvidia's most powerful chips. From a report: After multiple delays, the x86 giant on Wednesday formally introduced the new Xeon CPU family formerly known as Sapphire Rapids HBM and its new datacenter GPU better known as Ponte Vecchio. Now you will know them as the Intel Xeon CPU Max Series and the Intel Data Center GPU Max Series, respectively, which were among the bevy of details shared by Intel today, including performance comparisons. These chips, set to arrive in early 2023 alongside the vanilla 4th generation Xeon Scalable CPUs, have been a source of curiosity within the HPC community for years because they will power the US Department of Energy's long-delayed Aurora supercomputer, which is expected to become the country's second exascale supercomputer and, consequently, one of the world's fastest.

In a briefing with journalists, Jeff McVeigh, the head of Intel's Super Compute Group, said the Max name represents the company's desire to maximize the bandwidth, compute and other capabilities for a wide range of HPC applications, whose primary users include governments, research labs, and corporations. McVeigh did admit that Intel has fumbled in how long it took the company to commercialize these chips, but he tried to spin the blunders into a higher purpose. "We're always going to be pushing the envelope. Sometimes that causes us to maybe not achieve it, but we're doing that in service of helping our developers, helping the ecosystem to help solve [the world's] biggest challenges," he said. [...] The Xeon Max Series will pack up to 56 performance cores, which are based on the same Golden Cove microarchitecture features as Intel's 12th-Gen Core CPUs, which debuted last year. Like the vanilla Sapphire Rapids chips coming next year, these chips will support DDR5, PCIe 5.0 and Compute Express Link (CXL) 1.1, which will enable memory to be directly attached to the CPU over PCIe 5.0.

It has been almost three years since Chromebook users got word that Steam support is coming to ChromeOS. We're still not totally there yet, but today Google announced that it's ready to enter beta testing. From a report: In a blog post, Zach Alcorn, Google product manager, announced that Steam on Chromebooks is available as a beta with ChromeOS 108.0.5359.24 and later. Steam on ChromeOS entered alpha in March, and Alcorn said the updates announced today are based on "thousands of gameplay reports." The Steam on ChromeOS alpha required not just an Intel CPU, but also an Intel 11th-gen Core i5 chip with Intel's Iris Xe graphics. The beta supports Intel's latest 12th-gen chips and extends support to Team Red. Alcorn said the beta supports AMD's Ryzen 5000 C-Series CPUs.

Apple's next group of Macs probably won't launch until early next year, Bloomberg News reports, which means it will have fewer new devices to sell in the holiday quarter. From the report: Apple has been gearing up to launch a slew of new Macs, and now we have a clearer idea of when that will occur: early next year. I'm told that Apple is aiming to introduce the upgraded models -- including M2-based versions of the 14-inch and 16-inch MacBook Pros -- in the first quarter of calendar 2023 and has tied the launches to the upcoming macOS Ventura 13.3 and iOS 16.3. Those software updates are expected to debut between early February and the beginning of March.

[...] The new MacBook Pros will continue to look like the current models, but they'll trade their M1 Pro and M1 Max chips for the first M2 Pro and M2 Max processors. The M2 Max will go to 12 CPU cores, up from 10, and see its top graphics option move to 38 cores from 32. A new Mac mini remains in development, and the company continues to test versions with the same M2 chip as the 13-inch MacBook Air and MacBook Pro, as well as an M2 Pro chip, which hikes the CPU and graphics counts. If Apple indeed launches the M2 Pro variation, we can expect the company to probably wind down the still-available Intel model.

An anonymous reader quotes a report from The Register: AMD turned to advanced packaging to create chiplet designs and become a formidable CPU player again. Apple used the tech to beef up the power of its M1 Ultra chip. And Intel is pinning its future success on 2D and 3D multi-die packaging technologies as part of its ambitious comeback plan. Now TSMC, the world's largest contract chipmaker, wants to make chiplet-based products easier and faster to manufacture using its growing toolbox of advanced packaging tech that has already benefited the likes of AMD, Apple, and others. The Taiwanese foundry giant plans to do this through the formation of the 3DFabric Alliance, announced Thursday, which aims to help chip designers implement advanced packaging tech into their plans faster by collaborating with partner companies that are key to the development process.

TSMC's partners cover several important elements of chip development, from electronic design automation and memory to substrates and testing. As part of the new alliance, they will have early access to TSMC's 3DFabric portfolio of 3D silicon stacking and advanced packaging technologies. The goal is to allow these partners to build new solutions in parallel with the development of TSMC's 3DFabric tech so that chip designers can get their hands on the tools, technologies, materials, and other resources necessary to make multi-die chip packages faster. TSMC's 3DFabric portfolio includes brand-new technology, like system-on-integrated-chips (SoIC), which underpins the 3D V-Cache tech in AMD's Milan-X and Ryzen 7 5800X3D processors that came out this year. The portfolio also includes older technologies: integrated-fan-out and chip-on-wafer-on-substrate (CoWoS), which have received new iterations over the past several years. Those using CoWoS include Nvidia and Amazon Web Services. Representatives from AMD, Nvidia, and AWS gave support for the new alliance, which is one of several set up by TSMC as part of its Open Innovation Platform initiative. TSMC veep of R&D, LC Lu, said while advanced packaging technologies can "open the door to a new era of chip-level and system-level innovation," "extensive ecosystem collaboration" is required to "help designers navigate the best path through the myriad options and approaches available to them."

"Through the collective leadership of TSMC and our ecosystem partners, our 3DFabric Alliance offers customers an easy and flexible way to unlocking the power of 3D [integrated circuits] in their designs," he added.