CNN reports: The California Department of Forestry and Fire Protection [known as Cal Fire] says it has a new tool to battle wildfires before they explode — artificial intelligence. "I think it is a game changer ... It has enhanced our abilities to validate situational awareness and then respond in a quick fashion," Phillip SeLegue, Cal Fire's staff chief for fire intelligence, told CNN.

Deep in the California wilderness of the Cleveland National Forest in San Diego County, a fire started in the middle of a July night. No fire officials were in the area, but AI was watching and alerted the authorities. "The dispatch center there was not aware of the fire," said Scott Slumpff, battalion chief of the intel program at Cal Fire, who was testing the new technology at the time and received the initial alert. Cal Fire, in partnership with the University of California at San Diego's Alert California program and its network of more than 1,000 cameras across the state, is using the technology to spot fires early. "The camera had done its 360 [degree turn], identified an anomaly, stopped and was zoomed in," Slumpff explained. He then confirmed it was a fire and immediately dispatched resources. "They were able to hold it to a 10 by 10 [foot] spot out in the middle of the forest..."

The pilot program was so successful, Cal Fire expanded the technology at the beginning of September to all 21 of its dispatch centers across the state... Cal Fire says 40% of fires since July 10 have been detected by AI before a 911 call was received — and the technology is continuing to learn and improve.
"We have multiple successes of fires at night that had gone undetected that we were able to suppress before a 911 call had even come into the command centers," Cal Fire's staff chief for fire intelligence, told CNN.

"The fires you don't hear about in the news is the greatest success."

The European Commission has re-imposed a fine of about $400 million on chipmaker Intel for abusing its dominant position in the x86 processor market. The move is the latest twist in an antitrust saga that has been now running for more than two decades. The Register: According to the Commission, the fine is in response to previously established anticompetitive practices by the silicon giant, aimed at excluding competitors from the market in breach of EU competition rules. The original fine handed to Intel in 2009 was for $1.2 billion, based on findings that the company had given incentives to PC makers to use its CPUs instead of those from rivals, or else delay the launch of specific products containing rival chips.

These incentives consisted of wholly or partially hidden rebates for using Intel chips, or payments in order to delay launching products with rival chips, amounting to so-called "naked restrictions." It ultimately goes back to complaints from rival CPU maker AMD in 2000 and again in 2003 that Intel was engaging in anticompetitive conduct by offering rebates to vendors to favor Intel components. Intel fought the decision, but an appeal by the Silicon Valley outfit to have it overturned was initially denied in 2014. Then in 2022, the EU General Court partially annulled the 2009 ruling by the Commission, in particular the findings related to Intel's conditional rebates, and went on to nix the fine imposed on the company in its entirety.

Microsoft just showed off its new high-end convertible laptop, the Surface Laptop Studio 2, at its launch event in New York City. The Laptop Studio 2 keeps the overall aesthetic of its predecessor, including the pull-forward 14.4-inch display that makes it a much more touch-friendly device but adds some welcome power-user features. From a report: The Studio 2, which starts at $1,999, runs on Intel's 13th Generation chips -- specifically the i7 H class -- with an Nvidia RTX 4050 or RTX 4060 GPU inside. It also has an Intel Neural Processing Unit, or NPU, which is the first Intel NPU in a Windows computer. (There were rumblings that Microsoft might be making this chip itself, but it appears not.) You can configure it with up to 2TB of storage and 64 gigs of RAM. In all, Microsoft says it's "the most powerful Surface we've ever built" and promises twice the performance of the previous device.

The Studio 2 also offers some big new connectivity options: it has two USB-C ports, one USB-A port, a microSD card reader, and the Surface Slim Pen 2. In addition, there's a new customizable and more responsive haptic touchpad that Microsoft calls "the most inclusive touchpad on any laptop."

At the Open Source Summit Europe in Bilbao, Spain, the Linux Foundation this week announced the launch of the Unified Acceleration (UXL) Foundation. The group's mission is to deliver "an open standard accelerator programming model that simplifies development of performant, cross-platform applications." From a report: The foundation's founding members include the likes of Arm, Fujitsu, Google Cloud, Imagination Technologies, Intel, Qualcomm and Samsung. The company most conspicuously missing from this list is Nvidia, which offers its own CUDA programming model for working with its GPUs. At its core, this new foundation is an evolution of the oneAPI initiative, which is also aimed to create a new programming model to make it easier for developers to support a wide range of accelerators, no matter whether they are GPUs, FPGAs or other specialized accelerators. Like with the oneAPI spec, the aim of the new foundation is to ensure that developers can make use of these technologies without having to delve deep into the specifics of the underlying accelerators and the infrastructure they run on.

Intel Chief Executive Officer Pat Gelsinger, plotting a comeback for the once-dominant chipmaker, made the case that the company's technology will be vital to an industrywide boom in artificial intelligence computing. From a report: Speaking at Intel's annual Innovation conference, Gelsinger pointed to advances that his company is making in production technology and software developer tools for AI. The opportunity will only grow as more artificial intelligence capabilities are powered by personal computers, he said. "AI represents a generational shift, giving rise to a new era of global expansion where computing is even more foundational to a better future for all," Gelsinger said.

"For developers, this creates massive societal and business opportunities to push the boundaries of what's possible, to create solutions to the world's biggest challenges." Gelsinger is trying to fire up interest in Intel's technology and return to an era when its annual conferences offered a road map for the whole computing industry. He argues that artificial intelligence use won't be confined to the data centers of giant cloud providers, which rely heavily on chips from Nvidia. Instead, it will fan out into new areas, including the now-moribund PC market.

Intel has taken the wraps off its forthcoming next-gen Meteor Lake processors following its successful 12th (Alder Lake) and 13th Gen (Raptor Lake) processors with its new E- and P-core design. WindowsCentral: Its first chip built on the Intel 4 process node with Foveros 3D packaging, Intel calls Meteor Lake its "biggest architectural shift in 40 years" and that it will "lay the foundation for innovations for the PC," as noted by Tim Wilson, VP, Design and Engineering Group and GM, SoC Design at Intel. Meteor Lake is Intel's next-gen CPU and the first built on the Intel 4 process, which is part of Intel's long-term goal of "5 nodes in 4 years." Previous generation naming would suggest it would be called Intel 14th Gen, but Intel is moving away from its older naming schema. Some reports have suggested Meteor Lake may reflect a reboot in generation numbers. Current rumors suggest Intel 14th Gen is simply a refresh of Raptor Lake, although Meteor Lake may play a part in that for laptops.

Meteor Lake processors are expected to ship in late 2023 or early 2024 in new laptops with thinner and lighter designs, better cooling, and much better battery life. The significant change for Meteor Lake is what Intel calls disaggregation, which means the breaking down of core components into separate 'tiles' on the SoC. Meteor Lake features four Tiles, including:
Compute Tile: New E-core and P-core microarchitecture, built on Intel 4 process technology
SoC Tile: Low power island E-cores, NPU, Wi-Fi 6E/7, native HDMI 2.1 and 8K HDR AV1 support
Graphics Tile: Integrated Intel Arc architecture
IO Tile: Thunderbolt 4 (and presumably Thunderbolt 5) and PCIe Gen5

YouTuber Pitstoptech built a "fully upgradeable gaming handheld" around one of Framework's upgradable motherboards. Tom's Hardware reports: The handheld model you see in the video is equipped with the following components:

- Framework's Intel Core i7-1260P processor equipped mainboard
- 7-inch FHD touchscreen display
- 16 GB RAM
- 512 GB SSD
- Dual front-facing speakers
- Detachable controllers
- 55 Wh Battery
- High-speed Wi-Fi & Bluetooth

These components appear to offer some passable small-screen gaming. And in the video, you can see the device plugs into a larger monitor / TV where using the controllers in a detached configuration (Bluetooth) may be more comfortable. [...] Pitstoptech intends to prepare and sell handheld DIY kits "soon," based on the prototype design you see in the pictures / video.

Intel has showed off its initial work on developing a glass core substrate and associated packaging process for its chips. AnandTech: As a result of their progress with research and development on the class cores, Intel is now planning on introducing glass core substrates to its products in the second half of this decade, allowing them to package chips in more complex, and ultimately higher-performing configurations. There's a lot to unpack from Intel's relatively short announcement, but at a high level, glass core substrates have been under research for over a decade as a replacement for organic substrates, which are widely used in current-generation processors.

Essentially the medium that typical silicon dies sit on, substrates play an important part in chip packaging. First and foremost, they provide the structural stability for a chip (silicon dies are quite fragile and flimsy), and they are also the means through which signals from silicon dies are carried, either to other on-package dies (i.e. chiplets), or to the large number of relatively sizable pins/pads on the back side of a chip. And, as chip sizes have increased over the years -- and the number of pins/signals required by high-end chips has, as well -- so has the need for newer and better materials to use as a substrate, which is what's been driving Intel's latest accomplishment.

HP is the latest company to announce a foldable-screen PC. From a report: The 17-inch Spectre Foldable PC has a keyboard that can be used wirelessly with the device propped up on its kickstand. Or you could magnetically attach the keyboard to the screen's bottom half or even slide the keyboard toward you for a 1.5-screen-like experience. The OLED device addresses concerns around battery life and portability by including two battery packs instead of one. But the bendy, Intel 12th-gen computer will have to do quite a lot to even begin rationalizing its staggering $5,000 price. The Spectre Fold works as a 17-inch, 0.33-inch (8.5 mm) thick OLED tablet. Uniquely, it has an integrated kickstand for propping the PC up at a 120-degree angle. This is key because HP cites the kickstand as one of the reasons the computer is so costly, but this also means you don't have to deal with separate origami stands/sleeves.

With the PC propped up, it should be easy to work with the included wireless keyboard or stylus, which both charge wirelessly on the device. The Bluetooth keyboard can attach to the bottom half of the PC's screen for a 12.3-inch laptop view. If you slide the keyboard down toward you, revealing more of the OLED, the PC will automatically display windows north of the keyboard. This scenario is like working on a 14-inch laptop. HP says it worked with Microsoft to customize Windows 11's Snap feature so it's easy to bring a window or two to the space above the docked keyboard. Lenovo's Yoga Book 9i, a clamshell laptop with a second OLED screen where you'd expect the keyboard and touchpad to be, also lets you place windows on top of a docked keyboard. But when I tested that laptop, I typically found looking down physically uncomfortable.

Intel has unveiled Thunderbolt 5, the latest iteration of its a standard aimed at enabling super-fast connectivity. From a report: With Thunderbolt 5, Intel promises a significant leap in connectivity speed and bandwidth, delivering enhanced performance for computer users. The unveiling of a prototype laptop and dock accompanied the announcement, providing a glimpse into the future of Thunderbolt technology.

Thunderbolt 5 will offer an impressive 80 gigabits per second (Gbps) of bi-directional bandwidth, enabling lightning-fast data transfer and connectivity. Additionally, with the introduction of Bandwidth Boost, Thunderbolt 5 will reach up to 120 Gbps, ensuring an unparalleled display experience for users. These advancements represent two to three times more bandwidth than Thunderbolt 4. And it can deliver up to 240 watts of power.

An artificial intelligence benchmark group called MLCommons unveiled the results on Monday of new tests that determine how quickly top-of-the-line hardware can run AI models. From a report: A Nvidia chip was the top performer in tests on a large language model, with a semiconductor produced by Intel a close second. The new MLPerf benchmark is based on a large language model with 6 billion parameters that summarizes CNN news articles. The benchmark simulates the "inference" portion of AI data crunching, which powers the software behind generative AI tools.

Nvidia's top submission for the inference benchmark build around eight of its flagship H100 chips. Nvidia has dominated the market for training AI models, but hasn't captured the inference market yet. "What you see is that we're delivering leadership performance across the board, and again, delivering that leadership performance on all workloads," Nvidia's accelerated computing marketing director, Dave Salvator, said. Intel's success is based around its Gaudi2 chips produced by the Habana unit the company acquired in 2019. The Gaudi2 system was roughly 10% slower than Nvidia's system.

An anonymous reader quotes a report from TechCrunch: Two weeks after Intel said it would cancel its plan to acquire Tower Semiconductor for $5.4 billion amidst pushback from regulators, the two companies intend to work together anyway. Intel today said that it would provide foundry services and 300mm manufacturing capacity to Tower. As part of the deal, Tower would use Intel's plant in New Mexico, operated by Intel Foundry Services (IFS), investing up to $300 million to "acquire and own equipment and other fixed assets" that would be installed in the manufacturing facility.

The deal will give Tower a new capacity corridor, it said, of "over 600,000 photo layers per month" to meet expected demand for 300mm chips. The deal will mean that Intel will be manufacturing Tower's 65-nanometer power management BCD (bipolar-CMOS-DMOS) flows. Tower itself also owns its own manufacturing facilities in owns manufacturing facilities in Israel (150mm and 200mm), the U.S. (200mm), Japan (200mm and 300mm) and soon in Italy in partnership with STMicroelectronics. "We launched Intel Foundry Services with a long-term view of delivering the world's first open system foundry that brings together a secure, sustainable, and resilient supply chain with the best of Intel and our ecosystem. We're thrilled that Tower sees the unique value we provide and chose us to open their 300mm U.S. capacity corridor," said Stuart Pann, Intel SVP and GM of Intel Foundry Services, in a statement.

"We are excited to continue working with Intel," added Tower CEO Russell Ellwanger. "As we look to the future, our primary focus is to expand our customer partnerships through high-scale manufacturing of leading-edge technology solutions. This collaboration with Intel allows us to fulfill our customers' demand roadmaps, with a particular focus on advanced power management and radio frequency silicon on insulator (RF SOI) solutions, with full process flow qualification planned in 2024. We see this as a first step towards multiple unique synergistic solutions with Intel."

"Viasat Inc. has more than $1 billion of orbiting satellites in trouble," reports Bloomberg, "and space insurers are girding for market-rattling claims." The company's roughly $1 billion ViaSat-3 Americas satellite, central to expanding its fixed-broadband coverage and fending off rivals including Elon Musk's Starlink, suffered an unexpected problem as it deployed its antenna in orbit in April. Should Viasat declare it a total loss, industry executives estimate the claim would reach a record-breaking $420 million and, in turn, make it harder — and more expensive — for other satellite operators to get insurance... Viasat on Aug. 24 reported another stricken spacecraft, saying its Inmarsat-6 F2 satellite launched in February suffered a power problem. The failure may end the craft's useful life and result in a $350 million insurance claim, Space Intel Report said.

Viasat's troubles in orbit come a few years after big-name insurers like American International Group Inc. and Allianz SE have shuttered their space portfolios. That's left a smaller pool of providers to absorb the risks in the notoriously high-stakes $553 million market...

Following news of the Inmarsat-6 anomaly, Viasat and other industry participants "will likely experience significant challenges with obtaining insurance for future satellite launches," [investment banking firm] William Blair's Louie DiPalma said in an Aug. 25 note... In 2019, the total losses from satellite claims amounted to $788 million, which overwhelmed the total premiums for the year at $500 million, according to launch and satellite database Seradata. In the years that followed, big names like American International Group Inc., Swiss Re AG, and Allianz SE all closed the door on satellite insurance.
Earlier this month Viasat's CEO says before deciding whether they'll file a claim, "There's no consequences to us taking another couple or three months to get good measurements and then making those decisions."

An anonymous reader quotes a report from Ars Technica: Russia's military intelligence unit has been targeting Ukrainian Android devices with "Infamous Chisel," the tracking name for new malware that's designed to backdoor devices and steal critical information, Western intelligence agencies said on Thursday. "Infamous Chisel is a collection of components which enable persistent access to an infected Android device over the Tor network, and which periodically collates and exfiltrates victim information from compromised devices," intelligence officials from the UK, US, Canada, Australia, and New Zealand wrote (PDF). "The information exfiltrated is a combination of system device information, commercial application information and applications specific to the Ukrainian military."

Infamous Chisel gains persistence by replacing the legitimate system component known as netd with a malicious version. Besides allowing Infamous Chisel to run each time a device is restarted, the malicious netd is also the main engine for the malware. It uses shell scripts and commands to collate and collect device information and also searches directories for files that have a predefined set of extensions. Depending on where on the infected device a collected file is located, netd sends it to Russian servers either immediately or once a day. When exfiltrating files of interest, Infamous Chisel uses the TLS protocol and a hard-coded IP and port. Use of the local IP address is likely a mechanism to relay the network traffic over a VPN or other secure channel configured on the infected device. This would allow the exfiltration traffic to blend in with expected encrypted network traffic. In the event a connection to the local IP and port fails, the malware falls back to a hard-coded domain that's resolved using a request to dns.google.

Infamous Chisel also installs a version of the Dropbear SSH client that can be used to remotely access a device. The version installed has authentication mechanisms that have been modified from the original version to change the way users log in to an SSH session. [...] The report didn't say how the malware gets installed. In the advisory Ukraine's security service issued earlier this month (PDF), officials said that Russian personnel had "captured Ukrainian tablets on the battlefield, pursuing the aim to spread malware and abuse available access to penetrate the system." It's unclear if this was the vector.

An anonymous reader writes: A Guangdong-based state-backed enterprise in charge of e-government projects in the Southern Chinese province has apologized after admitting that its "home-developed" software was based on open-source code from US tech giant Microsoft. Digital Guangdong, known as DigitalGD, published an apology last week after it was revealed that its CEC-IDE software application, which helps programmers write code, was based on Microsoft's Visual Studio Code (VS Code), with just minor modifications and certain functions added.

VS Code is available under the Massachusetts Institute of Technology licence, a permissive open source licence allowing for reuse even for commercial purposes. DigitalGD said this fact was not disclosed due to "negligence," and admitted that its description of its software as "self-developed" has met scrutiny and doubt from Chinese programmers. "We are deeply sorry and humiliated for this, and relevant teams have been ordered to make rectifications," the company said. "Chinese authorities have repeatedly demanded 'safe and controllable' hardware and software for key infrastructure, rewarding businesses for indigenous innovations, but this has motivated some companies to make false claims about their products," notes the South China Morning Post.

A similar incident happened in May when a Shenzhen-based Powerleader announced a "home developed" Powerstar P3-01105 CPU that was later revealed to be Intel's Core i3-10105 Comet Lake CPU.

According to DigiTimes, Apple will receive all TSMC's first-generation 3-nanometer process chips this year for its upcoming devices. MacRumors reports: As early as May, Apple was known to have booked nearly 90% of the Taiwanese pure-play foundry for its upcoming next-gen devices. However, Apple is now projected to take 100% of TSMC's capacity in 2023, due to delays in Intel's wafer needs owing to later modifications to the company's CPU platform design plans. Intel's lack of orders means TSMC's sales of 3nm chips will be significantly lower this year. While TSMC is still expected to experience significant growth in the fourth quarter as it starts mass producing 3nm chips for Apple's needs, they too have been downgraded, according to DigiTimes' industry sources.

The report suggests TSMC's 3nm process output may be reduced to 50,000-60,000 wafers monthly in the fourth quarter, down from the 80,000-100,000 units previously anticipated, due to a cutback in Apple's orders. The current monthly output of TSMC's 3nm process is estimated at approximately 65,000 wafers, the outlet's sources said. Apple's upcoming iPhone 15 Pro models are expected to feature the A17 Bionic processor, Apple's first iPhone chip based on TSMC's first-generation 3nm process, also known as N3B. The E3nm technology is said to deliver a 35% power efficiency improvement and 15% faster performance compared to 4nm, which was used to make the A16 Bionic chip for the iPhone 14 Pro and Pro Max.

ZDNet's Steven Vaughan-Nichols shares what's new in the release of Linux 6.5: The biggest news for servers -- and cloud Linux users -- is AMD Ryzen processors' P-State support. This support should mean better performance and power use across CPU cores. Intel Alder Lake CPUs have also received improved load balancing in a related development. RISC-V architecture fans will be pleased to find Linux now has Advanced Configuration and Power Interface (ACPI) support. ACPI is used in Linux and other operating systems for power management. It's vital for laptops and other battery-powered systems.

For better security, people using virtual machines or sandboxes based on Usermode Linux for testing, or running multiple versions of Linux at once, now have Landlock support. Landock is a Linux Security Module that enables applications to sandbox themselves by selecting access rights to directories. It's designed to be used by unprivileged processes while following the system security policy. To make talking with the rest of the world easier, Linux 6.5 now supports USB 4v2. This new USB-C standard will support up to an eye-watering 120Gbps. And while we're still getting used to Wi-Fi 6E, the Wi-Fi Alliance is already working on bringing us Wi-Fi 7. When Wi-Fi 7 arrives, with its theoretical maximum speed of 46Gbps, Linux will be ready. As usual, the new Linux has many more built-in audio and graphics drivers. The Bcachefs filesystem didn't make it into Linux 6.5, notes Vaughan-Nichols. "While the Bcachefs filesystem looks good, there's been a lot of developers fighting about the development process. These personal arguments have led Torvalds to decide not to incorporate Bcachefs into Linux 6.5."

Linus Torvalds announced Linux 6.5's delivery in a brief post on August 27.

Intel says its upcoming "Sierra Forest" data center chip due out next year will have 240% better performance per watt than its current generation chip. It's the first time the company has disclosed such figures, notes Reuters. From the report: The company is for the first time splitting its data center chips into two categories: A "Granite Rapids" chip that will focus on performance but consume more power, and the more efficient "Sierra Forest" chip. Ronak Singhal, a senior fellow at Intel, said the company's customers can consolidate older software onto a smaller number of computers inside a data center.

"I may have things that are four or five, six years old. I can get power savings by moving something that's currently on five, 10 or 15 different servers into a single" new chip, Singhal said. "That density drives their total cost of ownership. The higher the density, the fewer systems they need."

An anonymous reader shared this report from 9to5Linux: Just a couple of days after celebrating its 32nd anniversary , Linus Torvalds announced today the final release of the Linux 6.5 kernel series as a major update that introduces several new features, updated and new drivers for better hardware support, and other changes.

After seven weeks of RCs, Linux kernel 6.5 is here with new features like MIDI 2.0 support in ALSA, ACPI support for the RISC-V architecture, Landlock support for UML (User-Mode Linux), better support for AMD "Zen" systems, as well as user-space support for the ARMv8.8 memcpy/memset instructions. Also new in Linux 6.5 is Intel TPMI (Topology Aware Register and PM Capsule Interface) support for the power capping subsystem and a TPMI interface driver for Intel RAPL, and the "runnable boosting" feature in the EAS balancer to improve CPU utilization for specific workloads.

This release also improves SMP scheduling's load balancer to recognize SMT cores with more than one busy sibling and allows lower-priority CPUs to pull tasks to avoid superfluous migrations, and improves EXT4 file system's journalling, block allocator subsystems, and performance for parallel DIO overwrites.

AMD on Friday announced its long-awaited middle members of the Radeon RX 7000 series, the Radeon RX 7800 XT and Radeon RX 7700 XT. From a report: Today, the company is finally filling in that gap with the new Radeon RX 7800 XT and RX 7700 XT, both advertised as 1440p graphics cards and available starting at $449 and $499, respectively. Both cards will be available on September 6. And most Radeon RX 6000 and RX 7000 GPUs sold between now and September 30 will come with a free copy of Bethesda's upcoming "Skyrim in space" title, Starfield.

The RX 7700 XT and 7800 XT are based on the same RDNA 3 graphics architecture as the other 7000-series GPUs, which means a more efficient manufacturing process than the RX 6000 series, DisplayPort 2.1 support, and hardware acceleration for encoding with the AV1 video codec, which promises game streamers either higher-quality video at the same bitrate as older codecs or the same quality with a lower bitrate. AMD compared the 7800 XT and 7700 XT favorably to Nvidia's $600 upper-midrange RTX 4070 and the $500 16GB version of the RTX 4060 Ti. The new Radeon cards also support FidelityFX Super Resolution (FSR) version 3, a new version of AMD's GPU-agnostic AI upscaling technology that also promises extra AI-generated frames a la Nvidia's proprietary DLSS 3 and DLSS Frame Generation feature. But unlike Nvidia, AMD isn't restricting FSR 3 to its latest cards, and users of RX 6000-series cards plus recent Nvidia GeForce and Intel Arc cards will be able to benefit, too, at least when games start supporting it.