Chipmaker AMD has hinted that new transistor technology will keep Moore's Law alive for the next six to eight years, but as one might guess, it will cost more. From a report: Meanwhile, the company still plans to market new chips based on its Zen 4 architecture next year, including Bergamo, which is intended to compete against Arm-based chips for cloud-native computing. In an interview with Wells Fargo analyst Aaron Rakers at the financial outfit's TMT Summit, AMD CTO Mark Papermaster talked about future directions and the company's near-term roadmap. Rakers asked about the Zen family and its chiplet-based architecture versus the monolithic architecture seen with Intel's CPUs, and whether this would continue to serve AMD for the next four to five years, or whether another novel approach might be needed.

"Innovation always finds its way around barriers," Papermaster said. "I can see exciting new transistor technology for the next -- as far as you can really plot these things out -- about six to eight years, and it's very, very clear to me the advances that we're going to make to keep improving the transistor technology, but they're more expensive," he said. In the past, chipmakers like AMD and Intel could double the transistor density every 18 to 24 months and stay within the same cost envelope, but that is not the case anymore, Papermaster claimed. "So, we're going to have innovations in transistor technology. We're going to have more density. We're going to have lower power, but it's going to cost more. So how you put solutions together has to change," he said.

guest reader writes: Chipmaker Intel is offering staff in Ireland the opportunity to take three months' leave from their jobs, with the catch being that it is unpaid. The move is part of cost saving measures at the company. According to various reports in the Irish media, thousands of workers at Intel's manufacturing plant in Leixlip, County Kildare, were offered three months' voluntary unpaid leave in a bid to lower overheads.

The move follows Intel's announcement in October that it planned to lay off an unspecified number of employees worldwide, and even ditch some product lines, in response to a worsening economic situation. These plans are part of a massive reduction in spending, with Intel looking slash $3 billion annually starting next year and by between $8 billion and $10 billion by 2025. However, this isn't going to stop the chipmaker from continuing to invest in building new chip manufacturing plants, as Intel confirmed this week when the company reiterated its commitment to manufacturing expansions in the US and in Europe that are set to cost billions of dollars. In an official statement sent to The Register, Intel said it was taking steps to reduce costs and improve efficiencies detailed during its recent earnings call, while protecting the investments needed to position the company for long-term growth.

An anonymous reader shares a report: Nvidia's new RTX 4090 and 4080 GPUs both use a new connector called 12VHPWR to deliver power as a way to satisfy ever-more power-hungry graphics cards without needing to set aside the physical space required for three or four 8-pin power connectors. But that power connector and its specifications weren't created by Nvidia alone -- to ensure interoperability, the spec was developed jointly by the PCI Express Special Interest Group (PCI-SIG), a body that includes Nvidia, AMD, Intel, Arm, IBM, Qualcomm, and others.

But the overheating and melting issues experienced by some RTX 4090 owners recently have apparently prompted the PCI-SIG to clarify exactly which parts of the spec it is and is not responsible for. In a statement reported by Tom's Hardware, the group sent its members a reminder that they, not the PCI-SIG, were responsible for safety testing products using connector specs like 12VHPWR. "Members are reminded that PCI-SIG specifications provide necessary technical information for interoperability and do not attempt to address proper design, manufacturing methods, materials, safety testing, safety tolerances, or workmanship," the statement reads. "When implementing a PCI-SIG specification, Members are responsible for the design, manufacturing, and testing, including safety testing, of their products."

Amazon's cloud-computing unit is rolling out new chips designed to power the highest-end of computing, supporting tasks such as weather forecasting and gene sequencing. From a report: Amazon Web Services, the largest provider of over-the-internet computing, on Monday said it would let customers rent computing power that relies on a new version of its Graviton chips. Peter DeSantis, a senior vice president who oversees most of AWS's engineering teams, said in an interview that the product is a springboard for making what the industry calls high-performance computing more readily available.

The newest chip is the latest piece of Amazon's effort to build more of the hardware that fills the massive data centers that power AWS. Amazon says making its own chips will give customers more cost-effective computing power than they could get by renting time on processors built by the likes of Intel Corp., Nvidia Corp. or Advanced Micro Devices. The move has put AWS in direct competition with those companies, which are also among its biggest suppliers. DeSantis said the chipmakers remain "great partners," and that AWS plans to continue to offer high-performance computing services based on chips made by other companies.

On Tuesday, AWS Chief Executive Officer Adam Selipsky announced a new version of the Inferentia chip, which is designed to draw inferences from vast amounts of data. Inferentia2 is built to handle bigger sets of data than its predecessor, enabling things like software-generated images or detecting and interpreting human speech, Amazon said. [...] The latest version of AWS's line of Graviton processors, the Graviton3E, will have twice the ability of current versions in one type of calculations needed by high-performance computers, DeSantis said. When combined with other AWS technology, the new offering will be 20% better than the previous one. Amazon didn't say when services based on the new chip would be available.

Intel has officially revealed its Intel On Demand program that will activate select accelerators and features of the company's upcoming Xeon Scalable Sapphire Rapids processor. The new pay-as-you-go program will allow Intel to reduce the number of SKUs it ships while still capitalizing on the technologies it has to offer. From a report: Furthermore, its clients will be able to upgrade their machines without replacing actual hardware or offering additional services to their clients. Intel's upcoming Intel's 4th Generation Xeon Scalable Sapphire Rapids processors are equipped with various special-purpose accelerators and security technologies that all customers do not need at all times. To offer such end-users additional flexibility regarding investments, Intel will deliver them to buy its CPUs with those capabilities disabled but turn them on if they are needed at some point. The Software Defined Silicon (SDSi) technology will also allow Intel to sell fewer CPU models and then enable its clients or partners to activate certain features if needed (to use them on-prem or offer them as a service). The list of technologies that Intel wants to make available on demand includes Software Guard Extensions, Dynamic Load Balancer (DLB), Intel Data Streaming Accelerator (DSA), Intel In-Memory Analytics Accelerator (IAA), Intel In-Memory Analytics Accelerator, and Intel QuickAssist Technology (QAT) to accelerate specific workloads.

The head of Intel's revitalized contract chip manufacturing business plans to step down, The Register has learned, creating a setback for the x86 behemoth's big bet to take on Asian foundry giants TSMC and Samsung as part of its comeback plan. From the report: Randhir Thakur, senior vice president and president of Intel Foundry Services, "has decided to pursue other opportunities" but will continue to lead the business unit through the first quarter of 2023 to "ensure a smooth transition to a new leader," Intel CEO Pat Gelsinger said in an email to employees Monday that was seen by el Reg. Intel spokesperson William Moss confirmed the news with us. "We're grateful to Randhir for the tremendous progress IFS has made and for laying the foundation for Intel to become a world-class systems foundry," Moss said in a statement. "We wish him all the best in his new endeavors."

In his email, Gelsinger said he will share more information soon "about the new leader" for Intel Foundry Services, suggesting the company may have a successor in place -- or is at least close to having one. "Randhir has been a key member of the Executive Leadership Team for the past two and a half years and has served in several senior leadership roles since he joined us in 2017," Gelsinger wrote. "... His contributions to our [Integrated Device Manufacturing] 2.0 transformation are many, but most notable is his leadership in standing up our IFS business."

Intel revitalized its contract chip manufacturing business in early 2021 and renamed it Intel Foundry Services with the goal of competing with TSMC and Samsung, the world's two largest contract chip manufacturers that make chips for the likes of Intel rivals, including AMD, Nvidia, and Apple. In his email to employees, Gelsinger credited Thakur for establishing a "seasoned leadership team with veterans from leading foundries" like TSMC and Samsung. He added that the Intel Foundry Services leader also "secured major customer wins in the mobile and auto segments" and helped the company win the US government's RAMP-C award along with four customers for chip designs on its 18A node. "Since Q2, IFS has expanded engagements to seven of the 10 largest foundry customers coupled with consistent pipeline growth to include 35 customer test chips," Gelsinger said. "This is tremendous progress in only 20 months!" Intel has a pending $5.4 billion acquisition of Israeli chip manufacturer Tower Semiconductor, notes The Register. "Analysts responding to the news of Thakur's resignation said the move is likely happening because Intel plans to put Tower Semiconductor's management in charge of Intel Foundry Services." The deal is expected to close in the first quarter of 2023.

VMware today announced the launch of Fusion 13, the latest major update to the Fusion virtualization software. MacRumors reports: For those unfamiliar with Fusion, it is designed to allow Mac users to operate virtual machines to run non-macOS operating systems like Windows 11. Fusion 13 Pro and Fusion 13 Player are compatible with both Intel Macs and Apple silicon Macs equipped with M-series chips, offering native support. VMware has been testing Apple silicon support for several months now ahead of the launch of the latest version of Fusion.

With Fusion 13, Intel and Apple silicon Mac users can access Windows 11 virtual machines. Intel Macs offer full support for Windows 11, while on Apple silicon, VMware says there is a first round of features for Windows 11 on Arm. Users who need to run traditional win32 and x64 apps can do so through built-in emulation. Fusion 13 also includes a TPM 2.0 virtual device that can be added to any VM, storing contents in an encrypted section of the virtual machine files and offering hardware-tpm functionality parity. To support this feature, Fusion 13 uses a fast encryption type that encrypts only the parts of the VM necessary to support the TPM device for performance and security. The software supports OpenGL 4.3 in Windows and Linux VMs on Intel and in Linux VMs on Apple silicon.

An anonymous reader quotes a report from VentureBeat: On Monday, Intel introduced FakeCatcher, which it says is the first real-time detector of deepfakes -- that is, synthetic media in which a person in an existing image or video is replaced with someone else's likeness. Intel claims the product has a 96% accuracy rate and works by analyzing the subtle "blood flow" in video pixels to return results in milliseconds. Ilke Demir, senior staff research scientist in Intel Labs, designed FakeCatcher in collaboration with Umur Ciftci from the State University of New York at Binghamton. The product uses Intel hardware and software, runs on a server and interfaces through a web-based platform.

Unlike most deep learning-based deepfake detectors, which look at raw data to pinpoint inauthenticity, FakeCatcher is focused on clues within actual videos. It is based on photoplethysmography, or PPG, a method for measuring the amount of light that is absorbed or reflected by blood vessels in living tissue. When the heart pumps blood, it goes to the veins, which change color. With FakeCatcher, PPG signals are collected from 32 locations on the face, she explained, and then PPG maps are created from the temporal and spectral components. "We take those maps and train a convolutional neural network on top of the PPG maps to classify them as fake and real," Demir said. "Then, thanks to Intel technologies like [the] Deep Learning Boost framework for inference and Advanced Vector Extensions 512, we can run it in real time and up to 72 concurrent detection streams."

"FakeCatcher is a part of a bigger research team at Intel called Trusted Media, which is working on manipulated content detection -- deepfakes -- responsible generation and media provenance," she said. "In the shorter term, detection is actually the solution to deepfakes -- and we are developing many different detectors based on different authenticity clues, like gaze detection." The next step after that will be source detection, or finding the GAN model that is behind each deepfake, she said: "The golden point of what we envision is having an ensemble of all of these AI models, so we can provide an algorithmic consensus about what is fake and what is real." Rowan Curran, AI/ML analyst at Forrester Research, told VentureBeat by email that "we are in for a long evolutionary arms race" around the ability to determine whether a piece of text, audio or video is human-generated or not.

"While we're still in the very early stages of this, Intel's deepfake detector could be a significant step forward if it is as accurate as claimed, and specifically if that accuracy does not depend on the human in the video having any specific characteristics (e.g. skin tone, lighting conditions, amount of skin that can be see in the video)," he said.

An anonymous reader quotes a report from The Guardian: The powerful lithium ion batteries used in small electric vehicles are responsible for a growing epidemic of fires. This year, there have been about 200 fires and six deaths, according to the New York City fire department. This month, an e-bike fire inside a Manhattan high-rise apartment became an inferno that injured nearly 40 people and forced firefighters to evacuate residents using ropes. These fires can spread quickly and suddenly: "We have a fully formed fire within a matter of seconds," the chief fire marshal said at a news conference.

As the densest city in America, New York is a micro-mobility haven. Here, small electric vehicles aren't toys for weekend jaunts but vital tools for the estimated 65,000 delivery workers trying to scrape a living through low-paying apps. There are thousands of choices today if you want an e-bike, e-scooter or e-moped. Some of the high-end, name-brand machines are sold in beautiful downtown showrooms for well over $5,000. But many of the vehicles used by New York City's workers come from unknown manufacturers and are sold online or through small shops for between $1,000 and $2,000. Nearly all of these vehicles are powered by lithium ion battery packs, which contain tightly bundled cells that store energy as flammable chemicals. Typically, the cells are kept in sync by a piece of electronic circuitry called a battery management system, or BMS, which makes sure that the cells don't overcharge or release too much energy at once. But that careful balance can get disrupted due to damage, wear or faulty manufacturing, sometimes with dangerous results.

Lawmakers are worried too. The authority that manages New York's public housing proposed an e-bike ban on its property this year but backed down after an outcry from low-income residents. On Monday, the city council held a hearing where legislators touted bills to combat the battery fires, including a proposal to outlaw the sale of secondhand electric vehicle batteries, and another to ban all batteries that haven't been approved by a nationally recognized testing lab. If passed, that measure would force riders to use batteries such as those certified by the Illinois-based Underwriters Laboratory (UL), which subjects e-bikes and their batteries to rigorous testing on issues ranging from their performance under extreme temperatures to how easily fire spreads between cells. Manufacturers have to pay a "nominal" cost to undergo testing, said Robert Slone, UL's chief scientist, but "we see a lot of manufacturers showing interest in certifying the batteries". UL sent a statement to the city council supporting the proposed measures, though it said a total ban on used batteries could be overkill: "When done correctly, batteries can be safely repurposed." Something else that would make a big difference for workers is better intel. "Each fire happened, they say it's an e-bike, but we don't know which one it is," said Gustavo Ajche, the founder of Los Deliveristas Unidos, a prominent delivery worker labor group. "There's a lot of missing information."

What would be more useful, he said, would be if the fire department committed resources to testing and sharing details about which batteries were safe to use, so that workers could make more informed decisions.

Intel's latest plan to ward off rivals from high-performance computing workloads involves a CPU with large stacks of high-bandwidth memory and new kinds of accelerators, plus its long-awaited datacenter GPU that will go head-to-head against Nvidia's most powerful chips. From a report: After multiple delays, the x86 giant on Wednesday formally introduced the new Xeon CPU family formerly known as Sapphire Rapids HBM and its new datacenter GPU better known as Ponte Vecchio. Now you will know them as the Intel Xeon CPU Max Series and the Intel Data Center GPU Max Series, respectively, which were among the bevy of details shared by Intel today, including performance comparisons. These chips, set to arrive in early 2023 alongside the vanilla 4th generation Xeon Scalable CPUs, have been a source of curiosity within the HPC community for years because they will power the US Department of Energy's long-delayed Aurora supercomputer, which is expected to become the country's second exascale supercomputer and, consequently, one of the world's fastest.

In a briefing with journalists, Jeff McVeigh, the head of Intel's Super Compute Group, said the Max name represents the company's desire to maximize the bandwidth, compute and other capabilities for a wide range of HPC applications, whose primary users include governments, research labs, and corporations. McVeigh did admit that Intel has fumbled in how long it took the company to commercialize these chips, but he tried to spin the blunders into a higher purpose. "We're always going to be pushing the envelope. Sometimes that causes us to maybe not achieve it, but we're doing that in service of helping our developers, helping the ecosystem to help solve [the world's] biggest challenges," he said. [...] The Xeon Max Series will pack up to 56 performance cores, which are based on the same Golden Cove microarchitecture features as Intel's 12th-Gen Core CPUs, which debuted last year. Like the vanilla Sapphire Rapids chips coming next year, these chips will support DDR5, PCIe 5.0 and Compute Express Link (CXL) 1.1, which will enable memory to be directly attached to the CPU over PCIe 5.0.

It has been almost three years since Chromebook users got word that Steam support is coming to ChromeOS. We're still not totally there yet, but today Google announced that it's ready to enter beta testing. From a report: In a blog post, Zach Alcorn, Google product manager, announced that Steam on Chromebooks is available as a beta with ChromeOS 108.0.5359.24 and later. Steam on ChromeOS entered alpha in March, and Alcorn said the updates announced today are based on "thousands of gameplay reports." The Steam on ChromeOS alpha required not just an Intel CPU, but also an Intel 11th-gen Core i5 chip with Intel's Iris Xe graphics. The beta supports Intel's latest 12th-gen chips and extends support to Team Red. Alcorn said the beta supports AMD's Ryzen 5000 C-Series CPUs.

Apple's next group of Macs probably won't launch until early next year, Bloomberg News reports, which means it will have fewer new devices to sell in the holiday quarter. From the report: Apple has been gearing up to launch a slew of new Macs, and now we have a clearer idea of when that will occur: early next year. I'm told that Apple is aiming to introduce the upgraded models -- including M2-based versions of the 14-inch and 16-inch MacBook Pros -- in the first quarter of calendar 2023 and has tied the launches to the upcoming macOS Ventura 13.3 and iOS 16.3. Those software updates are expected to debut between early February and the beginning of March.

[...] The new MacBook Pros will continue to look like the current models, but they'll trade their M1 Pro and M1 Max chips for the first M2 Pro and M2 Max processors. The M2 Max will go to 12 CPU cores, up from 10, and see its top graphics option move to 38 cores from 32. A new Mac mini remains in development, and the company continues to test versions with the same M2 chip as the 13-inch MacBook Air and MacBook Pro, as well as an M2 Pro chip, which hikes the CPU and graphics counts. If Apple indeed launches the M2 Pro variation, we can expect the company to probably wind down the still-available Intel model.

An anonymous reader quotes a report from The Register: AMD turned to advanced packaging to create chiplet designs and become a formidable CPU player again. Apple used the tech to beef up the power of its M1 Ultra chip. And Intel is pinning its future success on 2D and 3D multi-die packaging technologies as part of its ambitious comeback plan. Now TSMC, the world's largest contract chipmaker, wants to make chiplet-based products easier and faster to manufacture using its growing toolbox of advanced packaging tech that has already benefited the likes of AMD, Apple, and others. The Taiwanese foundry giant plans to do this through the formation of the 3DFabric Alliance, announced Thursday, which aims to help chip designers implement advanced packaging tech into their plans faster by collaborating with partner companies that are key to the development process.

TSMC's partners cover several important elements of chip development, from electronic design automation and memory to substrates and testing. As part of the new alliance, they will have early access to TSMC's 3DFabric portfolio of 3D silicon stacking and advanced packaging technologies. The goal is to allow these partners to build new solutions in parallel with the development of TSMC's 3DFabric tech so that chip designers can get their hands on the tools, technologies, materials, and other resources necessary to make multi-die chip packages faster. TSMC's 3DFabric portfolio includes brand-new technology, like system-on-integrated-chips (SoIC), which underpins the 3D V-Cache tech in AMD's Milan-X and Ryzen 7 5800X3D processors that came out this year. The portfolio also includes older technologies: integrated-fan-out and chip-on-wafer-on-substrate (CoWoS), which have received new iterations over the past several years. Those using CoWoS include Nvidia and Amazon Web Services. Representatives from AMD, Nvidia, and AWS gave support for the new alliance, which is one of several set up by TSMC as part of its Open Innovation Platform initiative. TSMC veep of R&D, LC Lu, said while advanced packaging technologies can "open the door to a new era of chip-level and system-level innovation," "extensive ecosystem collaboration" is required to "help designers navigate the best path through the myriad options and approaches available to them."

"Through the collective leadership of TSMC and our ecosystem partners, our 3DFabric Alliance offers customers an easy and flexible way to unlocking the power of 3D [integrated circuits] in their designs," he added.

Intel has embarked on an aggressive cost-cutting push and is considering divestitures as the chip maker tries to navigate a sharp plunge in demand for PCs that has weighed on the company's earnings. From a report: Intel posted a 20% drop in third-quarter sales, issued a forecast for even weaker revenue in the current quarter and lowered its full-year outlook. The company is beginning targeted job cuts and making other adjustments including reducing factory hours to cope with the economic downturn, Chief Executive Pat Gelsinger said in an interview Thursday. He wouldn't specify how many of Intel's more than 120,000 employees would be affected.

"We are aggressively addressing costs and driving efficiencies across the business," he said. He added that the company was looking at possible divestitures, among other moves. Intel said it was working to deliver $3 billion in cost reductions in 2023, growing to $8 billion to $10 billion in annualized cost reductions and efficiency gains by the end of 2025. The company took a $664 million restructuring charge in the third quarter to reflect initial cost reductions.

A Redditor says they've managed to get a hold of an old Netflix server for free, and has posted a detailed online look at the once mysterious hardware. The devices were part of Netflix's Open Connect Content Delivery Network (CDN), and can often be found embedded within major ISP networks to ensure your Netflix streams don't suck. From a report: Reddit user PoisonWaffle3 said the ISP he currently works for has been offloading old Netflix servers as they upgrade to more modern equipment. In a Reddit thread titled "So I got a Netflix cache server..." he posted a photo of the server, which is bright Netflix red, and explained how he was curious about what's inside the boxes given how little public information was available.

"All I could find online was overviews, installation/config guides for their proprietary software, etc.," he said. "No specs, no clue what was inside the red box." Dave Temkin, Netflix's former Vice President of Network Systems Infrastructure told Motherboard there's nothing too mysterious about what the servers can do, though they significantly help improve video streaming by shortening overall content transit time. "They're just an Intel FreeBSD box," he said. "We got Linux running on some of the generations of that box as well."

Netflix's Open Connect Content Delivery Network hardware caches popular Netflix content to reduce overall strain across broadband networks. Netflix lets major broadband ISPs embed a CDN server on the ISP network for free; the shorter transit time then helps improve video delivery, of benefit to broadband providers and Netflix alike. It took all of three screws for PoisonWaffle3 to get inside the mysterious red unit, at which point users discovered a "fairly standard" Supermicro board, a single Xeon E5 2650L v2 processor, 64GB of DDR3 memory, and a 10 gigabit ethernet card. They also found 36 7.2TB 7200RPM drives and six 500GB Micron solid state drives, for a grand total of 262 terabytes of storage.

Intel Chief Executive Pat Gelsinger said that recently imposed U.S. restrictions on semiconductor-industry exports to China were inevitable as America seeks to maintain technological leadership in competition with China. From a report: Speaking at The Wall Street Journal's annual Tech Live conference, Mr. Gelsinger said the restrictions, which require chip companies to obtain a license to export certain advanced artificial-intelligence and supercomputing chips as well as equipment used in advanced manufacturing, are part of a necessary shift of chip supply chains. "I viewed this geopolitically as inevitable," Mr. Gelsinger said. "And that's why the rebalancing of supply chains is so critical." His comments Monday followed high-profile public lobbying of Congress to pass the bipartisan Chips and Science Act, which extends nearly $53 billion in subsidies for research and development and to build or expand fabs in the U.S., in July. Mr. Gelsinger was a leading advocate for the legislation.

Mr. Gelsinger has embarked on a massive expansion of chip plants, referred to as fabs. The company has announced plans to erect new facilities in Ohio, Germany and elsewhere since Mr. Gelsinger took over last year at a combined cost potentially topping $100 billion. "Where the oil reserves are defined geopolitics for the last five decades. Where the fabs are for the next five decades is more important," Mr. Gelsinger said Monday. Mr. Gelsinger said the ambition for efforts to boost domestic chip manufacturing in Western countries was to shift from about 80% in Asia to about 50% by the end of the decade, with the U.S. taking 30% and Europe the remaining 20%. "We would all feel so good" if that were to happen, he said.

An anonymous reader shares a report: On a recent afternoon, an unusual group of visitors peered through a window at Purdue University students tinkering in a lab: two dozen executives from the world's biggest semiconductor companies. The tech leaders had traveled to the small-town campus on the Wabash River to fix one of the biggest problems that they -- and the U.S. economy -- face: a desperate shortage of engineers. Leading the visitors on a tour of the high-tech lab, Engineering Professor Zhihong Chen mentioned that Purdue could really use some donated chip-making equipment as it scrambles to expand semiconductor education. "Okay, done. We can do that," Intel manufacturing chief Keyvan Esfarjani quickly replied. Just weeks before, his company broke ground on two massive chip factories in Ohio that aim to employ 3,000 people.

Computer chips are the brains that power all modern electronics, from smartphones to fighter jets. The United States used to build a lot of them but now largely depends on Asian manufacturers, a reliance that the Biden administration sees as a major economic and national security risk. Hefty new government subsidies aimed at reshoring manufacturing are sparking a construction boom of new chip factories, but a dire shortage of engineers threatens the ambitious project. By some estimates, the United States needs at least 50,000 new semiconductor engineers over the next five years to staff all of the new factories and research labs that companies have said they plan to build with subsidies from the Chips and Science Act, a number far exceeding current graduation rates nationwide, according to Purdue. Additionally, legions of engineers in other specialties will be needed to deliver on other White House priorities, including the retooling of auto manufacturing for electric vehicles and the production of technology aimed at reducing U.S. dependence on fossil fuels.

Memtest86+ just got its first update after 9 years. The program has reportedly been rewritten from scratch and is back in active development. The new version, 6.0, features a plethora of updates to bring the application up to date, and support the latest system hardware from Intel and AMD. Tom's Hardware reports: For the uninitiated, MemTest86 was originally created back in the mid 1990s, and was one of the earliest DDR memory testing applications for personal computers. But development stopped in 2013 once Memtest86 was split into Memtest86 and Memtest86", with the former being bought by PassMark. Officially, we don't know why development stopped. But compared to the now modern Memtest86, Memtest86+ is the open-source variant.

Needless to say, version 6.00 features a lot of updates, which were required to bring it up to modern standards compared to the 2013 version. The new version includes completely rewritten code for UEFI-based motherboards, the modern version of a BIOS, for both 32-bit and 64-bit versions of the application. Furthermore, the application features added support for x64 long mode paging, support for up to 256 cores, added detection for DDR4 and DDR5 memory -- since DDR3 was the latest memory standard in 2013 -- and adds support for XMP version 3.0.

CPU support has been significantly enhanced, addingdetection for all pre-Zen and AMD Zen-based processors ranging from the Ryzen 1000 series to 7000 series, and any older parts that were made after 2013. Intel support has also been added for chips up to 13th gen Raptor Lake. Finally, the last patch notes indicate version 6.0 adds support for older Nvidia and AMD chipsets - probably pre-2010 since it mentions Nvidia nForce chipsets, along with numerous bug fixes, optimizations and enhancements.

"Linus Torvalds has backed the idea of possibly removing Intel 486 (i486) processor support from the Linux kernel," reports Phoronix: After the Linux kernel dropped i386 support a decade ago, i486 has been the minimum x86 processor support for the mainline Linux kernel. This latest attempt to kill off i486 support ultimately arose from Linus Torvalds himself with expressing the idea of possibly requiring x86 32-bit CPUs with "cmpxchg8b" support, which would mean Pentium CPUs and later:

Maybe we should just bite the bullet, and say that we only support x86-32 with 'cmpxchg8b' (ie Pentium and later).

Get rid of all the "emulate 64-bit atomics with cli/sti, knowing that nobody has SMP on those CPU's anyway", and implement a generic x86-32 xchg() setup using that try_cmpxchg64 loop.

I think most (all?) distros already enable X86_PAE anyway, which makes that X86_CMPXCHG64 be part of the base requirement.

Not that I'm convinced most distros even do 32-bit development anyway these days.... We got rid of i386 support back in 2012. Maybe it's time to get rid of i486 support in 2022?
Towards the end of his post, Torvalds makes the following observation about i486 systems. "At some point, people have them as museum pieces. They might as well run museum kernels. "

Hardcore overclocker Elmor "officially broke the CPU frequency world record with Intel's brand-new Core i9-13900K 24-core processor," reports Tom's Hardware — by hitting "a staggering 8.812GHz using liquid nitrogen cooling, dethroning the 8-year reigning champion, the FX-8370, by 90MHz." That's right; it took eight years for a new CPU architecture to dethrone AMD's FX series processors. Those chips are infamous for their mediocre CPU performance at launch; however, these chips scaled incredibly well under liquid nitrogen overclocking....

Elmor accomplished this monumental feat thanks to Intel's new highly-clocked 13th Gen Raptor Lake CPU architecture. Out of the box, the Core i9-13900K can run over 5.5GHz on all P-cores while also hitting 5.8GHz under lightly threaded workloads. The 13900K is, by far, Intel's highest-clocking chip to date.